Compaq S5 Specifiche Pagina 78

  • Scaricare
  • Aggiungi ai miei manuali
  • Stampa
  • Pagina
    / 149
  • Indice
  • SEGNALIBRI
  • Valutato. / 5. Basato su recensioni clienti
Vedere la pagina 77
3. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink (1), (2),
and (3) and the processor (4), Northbridge chip (5), and graphics subsystem memory (6) each time the
heat sink is removed. Thermal material is included with all heat sink, system board, and processor spare
part kits.
Reverse this procedure to install the heat sink.
68 Chapter 4 Removal and replacement procedures
Vedere la pagina 77
1 2 ... 73 74 75 76 77 78 79 80 81 82 83 ... 148 149

Commenti su questo manuale

Nessun commento